Get Cheap Essay Help-ME 341 Heat Transfer Individual Design Project, Spring 2018
ME 341 – Heat Transfer
Individual Design Project, Spring 2018
Two integrated circuit devises, designated by the letters A and B, are mounted on a circuit board of dimension L x H consisting of a copper core of thickness c, laminated on each surface with an epoxy glass sheet of thickness g, as shown in Fig. 1. The circuit board is inserted in a card carrier which is cooled by flowing liquid water at temperature Tc. Air at temperature T∞ is also forced across the board to provide extra cooling. The circuit devices are mounted in chip sockets which make electrical contact through their base. The thermal bond between the chip sockets and the circuit board is such that the local socket temperature may be considered equal to the local board temperature. The power dissipation of each device, as well as other pertinent data, are summarized in Table 1. There must be at least a 10 mm gap between the edge of the board and each chip. If something necessary is not given here, make an appropriate engineering assumption or do some research on existing technology to find an appropriate number.
You are assigned to determine the optimal locations and orientations of the two chips on the circuit board to minimize the maximum chip temperature during operation. According to your design, what is the steady state temperature distribution in the board? The effect of losing air cooling is also to be analyzed in terms of the time history of the maximum chip temperature and the new equilibrium temperature distribution.
All modes of heat transfer must be considered, and any assumptions must be justified. If a computer program is necessary (including ANSYS), the accuracy of the program, as well as the results, need to be checked and verified. For example, it may be possible to check the program by comparing numerical results using different resolutions to show grid convergence, and against analytical results, obtained for some limiting case (e.g. steady state), to show correctness of the program. Your report, using the format given below, will be graded on the basis of the physical understanding exhibited, the clarity of writing and reasoning presented, and the quality of the design characteristics. The written report and a computer program or simulation, if necessary, are to be the original work of each individual student.
This project is due on reading day, Tuesday, May 8, 2018 by midnight.
Figure 1. Schematic of circuit board cooling design problem.
Design Project required report sections (there may be others you deem necessary):
1. Project Statement: Description of the problem
2. Discussion: Discussion of all modes of heat transfer that enter into the problem. What approximations are made and how are they justified.
3. Analysis: Formation and discussion of the mathematical problem. Include a discussion of your design methodology and how you went about minimizing the maximum chip temperature.
4. Results and Conclusions: Presentation of numerical and graphical results, discussion of results, and conclusions.
5. Appendix: Listing of computer program if necessary, and tabulated numerical results.
Table 1: Data for Circuit Board Device/System Property Scalar Value Units Integrated Device A L See Sheet mm Integrated Device A H See Sheet mm Integrated Device A Power Dissipation See Sheet W Integrated Device A Thickness 4 mm Integrated Device B L See Sheet mm Integrated Device B H See Sheet mm Integrated Device B Power Dissipation See Sheet W Integrated Device B Thickness 3 mm Circuit Board Length, L See Sheet mm Circuit Board Height, H See Sheet mm Circuit Board Core Thickness, c 2 mm Circuit Board Core Thermal conductivity, kc 200 W/m∙K Circuit Board Nonconductor thickness, g 0.5 mm Circuit Board Nonconductor Thermal Conductivity, kg 1 W/m∙K Cooling Systems Liquid Water Temp at board edge, Tc 20 °C Cooling Systems Air coolant temp, T∞ 75 °F
Name
L, Device A (mm)
H, Device A (mm)
Power, A (W)
L, Device B (mm)
H, Device B (mm)
Power, B (W)
Length of CB (mm)
Height of CB (mm)
Alameer, A.
40
15
2.5
75
30
7.5
200
100
Alatyah, H.
45
15
2.5
75
30
7.5
200
100
Almahamedh, A.
40
15
3
75
30
7.5
200
100
Almuhamidh, A.
40
15
2.5
80
30
7.75
200
100
Alostad, A.
40
15
2.5
75
30
7.5
225
100
Alqattan, M.
35
15
2.5
75
30
7.75
200
100
Alrashdi, S.
40
15
2.5
75
30
7.25
200
125
Alshamsi, A.
35
15
2.25
75
30
7.5
200
100
Alwabari, A.
35
15
2.25
75
35
7.5
200
100
Amero, J.
40
15
2.5
80
35
7.75
225
100
Brown, J.
45
20
2.5
75
30
7.5
200
100
Casavant, E.
45
15
2.75
75
30
7.5
200
125
Case, J.
45
20
2.75
75
30
7.5
200
125
Poole, T.
40
15
2.5
75
30
7.5
225
100
Salman, M.
45
15
2.5
75
30
7.5
225
100
Sapin, L.
40
15
3
75
30
7.5
225
100
Severino, J.
40
20
2.75
75
30
7.5
225
100
Yancey, L.
40
15
2.5
75
30
7.5
200
125